Speed+
PCI-E Gen 3.0
PCI-E 3.0 is the next evolution of the ubiquitous and general-purpose PCI Express I/O standard. At 8GT/s bit rate, the interconnect performance bandwidth is doubled over PCI-E 2.0, while preserving compatibility with software and mechanical interfaces.
USB 3.0
Experience Fastest data transfers at 5 Gbps with USB 3.0--the new latest connectivity standard. Built to connect easily with next-generation components and peripherals, USB 3.0 transfers data 10X faster and backward compatible with previous USB 2.0 components.
Durable+
Moistureproof PCB
The popularity of PC usage and working environment is getting deteriorating and moist(rural, coastal, etc.). The PCB will be oxidizing easily by damp or absorbed moisture, and ionic migration or CAF (Conductive Anodic Filament) will be generated. Moisture-proof PCB meets high density and high reliability requirements for moisture proof.
Low RdsOn P-Pak MOS
Low resistance design can significantly reduce the current out of energy loss.Low temperature, small size, excellent thermal conductivity.
Protection+
ESD Protection
ESD (Electrostatic Discharge) is the major factor to destroy PC by electrical overstress(EOS) condition, ESD occurred by PC users when touch any devices connect to PC, which may result in damage to motherboard or parts .ESD protection is designed to protect the motherboard and equipment from damage by EOS
USB Polyswitch
On board dedicated power fuse to help prevent USB port failure. It prevents USB Port overcurrent and safegurand your system and device lifespan.
อ้างอิงจาก : https://www.biostar.com/