GET READY FOR AMD RYZEN™ 3000-SERIES
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen™ Processors. The all-new design is a testament to GIGABYTE's dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 interfaces on select boards, refined audio,and high speed of Ethernet , to fulfill users' performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.
AMD StoreMI Technology
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen™ Processors. The all-new design is a testament to GIGABYTE's dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users' performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.
The benefits of AMD StoreMI:
- Making the PC experience fast, smooth and easy
- Optimizing computer responsiveness from system boot to application launch
- Offering SSD performance with HDD capacity at an affordable cost
- Quickly accessing key files by automatically learning users' computing behaviors
Detail information please refer AMD official website: https://www.amd.com/en/technologies/store-mi
Benefits of Lower RDS(on) MOSFETs
- Optimized gate charge to minimize switching losses.
- Lower temperature, smaller size, better thermal characteristics.
1. Enlarge MOSFET Heatsinks
Enlarge heatsink surface area improves thermal performance by increasing heat dissipation surface and maintain stylish aesthetic.
2. Thick Thermal Pad
Improve thickness of the thermal pad to 1.5mm, gives superior heat dissipation of MOSFETs.
Full PCIe 4.0 Design
GIGABYTE X570 motherboards push the envelope once again by featuring Full PCIe 4.0 Design, including PCIe 4.0 slots, PCIe 4.0 M.2 connectors and delivering highly optimized performance and flexibility demanded for power users and extreme gaming enthusiasts.
อ้างอิงจาก : https://www.gigabyte.com/