GET READY FOR AMD RYZEN™ 3000-SERIES
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen™ Processors. The all-new design is a testament to GIGABYTE's dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users' performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.
AMD StoreMI Technology
GIGABYTE X570 motherboards maximize your PC's potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system.
The benefits of AMD StoreMI:
- Making the PC experience fast, smooth and easy
- Optimizing computer responsiveness from system boot to application launch
- Offering SSD performance with HDD capacity at an affordable cost
- Quickly accessing key files by automatically learning users' computing behaviors
Detail information please refer AMD official website: https://www.amd.com/en/technologies/store-mi
Ultimate Power Design
To unleash the full potential of the 3rd Generation of AMD Ryzen™ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, the X570 AORUS is a true beast among motherboards.
X570 AORUS MASTER reaches a perfect balance between style and performance by combining the media acclaimed Fins-Array heatsink, a heatpipe, and a thermal baseplate, to provide 30% lower MOSFET temperatures for enthusiasts, overclockers and professional gamers
Fins-Array Heatsink with Direct Touch Heatpipe and High Thermal Conductivity Pad
X570 AORUS MASTER uses Fins-Array Heatsink which increases the heat dissipation area by 300% compared to traditional heatsinks of the same size. Direct Touch Heatpipe helps transfer heat from MOS fins. By using LAIRD 1.5mm thick, 5W/mK high thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time period.
Fins-Array enlarges surface area so heat can be taken away more quickly than others.
2.High Thermal Conductivity Pad
By using LAIRD 1.5mm thick, 5W/mK high thermal conductivity pads, it can transfer 2.7x more heat.
With an integrated base plate and additional backside heatsinks cool down the hottest area.
4.Direct Touch Heatpipe
Heatpipe directly touches the heating source VRM components that guarantee good contact between VRM and heatsink.