Thermal Design
- Fully Covered Thermal Design
- High coverage MOSFET Heatsinks to improve thermal efficiency with better airflow and heat exchange.
- LAIRD 5 W/mK Thermal Pad
- By using 1.5mm thicker 5 W/mK thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time.
- M.2 Thermal Guard
- Built-in M.2 heatsink prevent high-speed, PCIe 4.0 SSDs from throttling due to overheating.
Dual PCIe 4.0/3.0 x4 M.2
GIGABYTE AORUS Motherboards are focused on delivering M.2 technology to enthusiasts who want to maximize their system's potential.
M2P_CPU M.2 Slot (PCIe 4.0) Supported by 11th Generation processors only.
2.5GbE LAN Onboard • 2X Faster than ever
- Adoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least 2 times faster transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online gaming experience.
- Support Multi-Gig(10/100/1000/2500Mbps) RJ-45 ethernet
Intel® USB 3.2 Gen 2 Type-C™ Controller
Intel's native USB 3.2 Gen2 host controller provides USB 3.2 Gen2 ports with speeds up to 10Gbps .With twice the bandwidth compared to its previous generation as well as backwards compatibility with USB 2.0 and USB 3.2 Gen1 , the much improved USB 3.2 Gen2 protocol is available over the new reversible USB Type-C™ and the traditional USB Type-A connector for better compatibility over a wider range of devices.
RGB Fusion • Multi-Zone Light Show Design
Now offering more LED customizations than ever, users can truly adapt their PC to represent their lifestyle. With full RGB support and a redesigned RGB Fusion 2.0 application, the user has complete control over the LEDs which surround the motherboard.
Source : Gigabyte B560M AORUS ELITE (rev. 1.1)