GET READY FOR AMD RYZEN™ 3000-SERIES
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen™ Processors. The all-new design is a testament to GIGABYTE's dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users' performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.
GIGABYTE X570 motherboards maximize your PC's potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system.
The benefits of AMD StoreMI:
- Making the PC experience fast, smooth and easy
- Optimizing computer responsiveness from system boot to application launch
- Offering SSD performance with HDD capacity at an affordable cost
- Quickly accessing key files by automatically learning users' computing behaviors
Detail information please refer AMD official website: https://www.amd.com/en/technologies/store-mi
AORUS PERFORMANCE
Ultimate Power Design
To unleash the full potential of the 3rd Generation of AMD Ryzen™ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, the X570 AORUS is a true beast among motherboards.
1. Enlarge MOSFET Heatsinks
Enlarge heatsink surface area improves thermal performance by increasing heat dissipation surface and maintain stylish aesthetic.
2. Thick Thermal Pad
Improve thickness of the thermal pad to 1.5mm, gives superior heat dissipation of MOSFETs.
Full PCIe 4.0 Design
X570 AORUS pushes the envelope once again by featuring Full PCIe 4.0 Design, including PCIe 4.0 slots, PCIe 4.0 M.2 connectors and delivering highly optimized performance and flexibility demanded for power users and extreme gaming enthusiasts.
AORUS CONNECTIVITY
Next Generation Connectivity
A high-end product needs to be future-proof so your system stays up-to-date with the latest technology. X570 AORUS motherboards provide all next generation network, storage to keep you up to speed.
Source : Gigabyte X570 AORUS ELITE (rev. 1.0)